Qualcomm Announces Their First 5G mmWave Antenna Module: QTM052, Coming This Year

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According to (This article and its images were originally posted on AnandTech July 23, 2018 at 08:41AM.)

For the past couple of years now, Qualcomm has been very publicly putting together the final pieces of the puzzle that are 5G cellular. The company announced their discrete 5G NR modem – the Snapdragon X50 – all the way back in 2016. Meanwhile in 2017 they demonstrated their reference phone design, which integrated the in-development X50 with a prototype millimeter wave (mmWave) antenna, allowing Qualcomm and its OEM customers to begin field testing the technology in a handheld form factor. Now in 2018 as the launch of 5G NR networks close in, the company is announcing the final version of their mmWave antenna module, the QTM052.

Although the antenna isn’t getting an especially memorable name, it’s one of the key components of the 5G hardware ecosystem Qualcomm is building, and one they’re understandably proud of. mmWave is a critical component of the 5G specification, as it’s going to be these high (and relatively unused) frequencies that are going to give 5G enough spectrum to hit its multi-gigabit target speeds. And while the more traditional the sub-6GHz spectrum of 5G will see some improvements as well, it’s a much smaller gain tempered by limited spectrum and decreasing spectral efficiency gains.

The QTM052 is a complete antenna module, integrating the necessary mmWave radio transceiver, RF front end, power management IC, and the phased antenna array necessary to send and receive signals. The module is exclusively for mmWave frequencies – so everything over 24GHz – while separate antennas and RF modules will handle sub-6GHz bands. Of those high frequencies, the module supports bands n257 (800Mhz spread through 26.5 to 29.5GHz), band n261 (27.5 to 28.35GHz) and band n260 (37 to 40GHz). And while not explicitly called out by Qualcomm, as our resident mobile guru Andrei Frumusanu has noted, those bands mean that this antenna module is primarily going to be used in the United States, as it doesn’t include band n258 (24.25 to 27.5GHz) which is one of the principle bands for Europe and China.

Unfortunately Qualcomm isn’t disclosing some of the technical details of the module – particularly the number of individual antennas that make up the array size – nor the physical size of the module. As far as the array size goes, we have a suspicion that it’s 8×8, but that remains to be seen. However the module’s physical dimensions are easier to take a stab at. Having thankfully included a penny in their stock photo that we can use as a size comparison, some quick paper napkin math puts the module at roughly 19mm x 7mm, and 2.9mm thick. So while the module is small, it’s not tiny. Which is an important distinction when adding up how many modules will be needed.

Altogether the X50 modem supports up to 4 mmWave modules, and while Qualcomm mentions this number in their press release as well, talking to Qualcomm’s representatives they believe we’re more likely to see just 3 in smartphones. This will be on top of the antennas and supporting equipment necessary for the sub-6GHz bands – and we’re not even counting 4G and WiFi radios – which is why there’s such an emphasis on size.

The use of multiple antenna modules, in turn, is all about getting around the basic limitations of mmWave’s frequency: poor signal propagation. 24GHz+ is part of what the ITU defines as the “extremely high frequency” band, and signals in this band are attenuated and absorbed by essentially everything. The atmosphere, the weather, the phone body, and especially human hands are all blockers here, and even when the signal isn’t blocked, it’s functionally line-of-sight. So having 3 separate antenna modules is necessary to ensure that a phone has a chance of achieving line-of-sight with a base station. Even then, the 5G standard relies on high-precision beam forming & steering in order to send signals in the right direction, which is why the modules internally use such a sizable array of antennas. And while Qualcomm’s press release talks up this point a bit too loftily – saying that it was “previously thought unattainable” – it’s none the less not an easy problem to solve. And even if the technology works, the LOS requirements mean that the market considerations for mmWave are very different from the traditional cell tower paradigm, as many smaller base stations are required for good coverage.

Meanwhile, tangential to today’s antenna module announcement, Qualcomm is also announcing their more conventional RF modules for sub-6GHz 5G, the QPM56xx RF module family. These will be paired with the mmWave module, providing the necessary “baseline” (and building-penetrating) 5G connectivity.

Finally, as these are Qualcomm’s commercial antenna modules, the company is already ramping up their production. OEM customers are being sampled now, with volume shipments set to begin in November/December. Potential network readiness aside, the company thinks that their OEM partners can have mobile broadband adapters on the market before the year is out. Otherwise 5G-enabled smartphones are expected to start hitting the market in the first half of 2019.

On which note, it’s worth reminding everyone that the X50 is a discrete, 5G-only modem. So any of the first-generation phones integrating 5G connectivity with Qualcomm’s solution will require this separate modem on top of whatever they use for 4G connectivity, meaning there will be power and size trade-offs made that we haven’t seen since the first generation of LTE phones.

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This article and images were originally posted on [AnandTech] July 23, 2018 at 08:41AM. Credit to Author  yan Smith and AnandTech | ESIST.T>G>S Recommended Articles Of The Day.

 

 

 

Qualcomm’s latest chip will power affordable wireless earbuds

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According to Engadget (This article and its images were originally posted on Engadget June 29, 2018 at 08:39PM.)

At CES this January, Qualcomm introduced the QCC5100 chipset built to improve battery life, reception and processing power of wireless earbuds. Now the company has announced a cheaper version, the QCC3026, intended to make it easier for device companies to make their own entry-level and mid-tier Bluetooth-connected audio devices — especially as proprietary buds bundled with phones.

Per Qualcomm’s press release, its new chip offers improved connectivity between each earbud and to their paired smartphone, as well as good audio quality. It also better balances power distribution of the two buds, which should lower consumption for longer battery life. The company intends to make the chip’s designs available to device manufacturers in the second half of 2018 so they can make their own earbuds, but one has already put it to work. Oppo is using the QCC3026 in its O-Free, and as The Verge reports, those wireless earbuds will be bundled with the Lamborghini edition of the company’s flagship Find X smartphone. The O-Free will be available on its own in August for 699 Yuan (about $106).

 

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This article and images were originally posted on [Engadget] June 29, 2018 at 08:39PM. Credit to Author David Lumb, @OutOnALumb and Engadget | ESIST.T>G>S Recommended Articles Of The Day.

 

 

Samsung Galaxy Book 2018 spotted: but is it Qualcomm or Intel inside?

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According to TechRadar – All the latest technology news (This article and its images were originally posted on TechRadar – All the latest technology news June 29, 2018 at 11:18AM.)

Not long after Qualcomm teased a Windows 10 device from Samsung using its latest Snapdragon 850 chipset, a Samsung Galaxy Book that uses the operating system has been disclosed through a Russian Inspection Bureau EEC certificate.

First published on June 27, the certificate directly mentions a “Samsung Galaxy Book Windows tablet” and possible model numbers are listed: Samsung SM-W737 and SM-W738 and its variants: SM-W737A SM-W737N SM-W737V SM-W738N, as Dutch website LetsGoDigital reports.

Qualcomm and Samsung announced a few weeks prior to this that a Windows device using the chip maker’s latest system-on-a-chip for the platform was in the works. Could this be what they were talking about?

So, will it be Intel or Qualcomm inside?

With the Galaxy Book traditionally being a device that is primarily used as a tablet, like most Windows 10 devices that run on Snapdragon hardware, this Galaxy Book may be the tablet device that Qualcomm has been previously talking about.

Alternatively, Samsung could go with an Intel CPU, as it has with some of its other Windows tablets and laptops in the past (though likely using a Qualcomm modem for the LTE connectivity, anyway). Of course, the final outcome could be that Samsung delivers both options, much like the HP has done with the Envy x2.

If Samsung chooses the latter option, it better be careful so as to not confuse customers. As we all should know by now, most folks out there don’t know their processor from their memory, much less the brand names.

At any rate, we’ll now be watching the Samsung Galaxy Unpacked event in early August with bated breath.

Via MSPowerUser

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This article and images were originally posted on [TechRadar – All the latest technology news] June 29, 2018 at 11:18AM. Credit to Author  and TechRadar – All the latest technology news .

 

 

 

Snapdragon 1000 details leak: Qualcomm set to pass Atom, Celeron chips?

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According to Android Authority (This article and its images were originally posted on Android Authority June 25, 2018 at 04:55AM.)

Qualcomm’s Tech Summit in December 2017.

  • Qualcomm is reportedly eyeing Intel’s Core U and Y series with its upcoming Snapdragon 1000 chipset.
  • The new chip is said to pack a socketed design, which suggests the processor can be swapped out.
  • The new Snapdragon silicon is reportedly much bigger than previous chips from the company.

Reports emerged last month that Qualcomm is working on a Snapdragon 1000 chipset for more powerful Windows 10 machines. Now, more details have dropped via WinFuture.de (translated version), and it looks like the new chip is a big upgrade over existing Snapdragon silicon.

The earlier report noted that the new chipset would likely have new Cortex-A76 cores and lightweight Cortex-A55 cores. The latest news reveals Qualcomm has a test platform with a Snapdragon 1000 chipset (codenamed Project Poipu), 16GB of RAM, 256GB of storage, Gigabit Wi-Fi, and a new power management chip.

Read more: Snapdragon 850 could power foldable Windows phone/laptop hybrids

The new article adds that the Qualcomm CPUs draw 6.5 watts of power alone, and 12 watts of power in total. By comparison, Intel’s latest U series chips top out at 15 watts of power. In other words, the Snapdragon 1000 is approaching Intel’s latest two-in-one chips for power consumption. This means the new chip will probably be significantly better than the Atom and Celeron chips.

The new Qualcomm chip is apparently much bigger than previous Snapdragon flagship processors too — 20 x 15 millimeters versus 12.4 x 12.4 millimeters. Nevertheless, WinFuture says it’s still smaller than Intel’s 15-watt chips, which apparently measure 45 x 24 millimeters.

Snapdragon 1000 to be socketed?

The processor itself is apparently socketed like a traditional computer chipset — at least on the test hardware. It suggests that the owner of the test device can swap out the chip.

Does this mean consumers could also swap out their old Snapdragon processor for the latest chip in their Windows 10 machine? This would be new territory for Qualcomm’s wares, which are traditionally a tightly woven, interlinked package, with the processor soldered to the motherboard.

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The outlet also spotted a Qualcomm employee’s LinkedIn profile, which alludes to “desktop” products. By comparison, the Snapdragon 835 found itself in two-in-ones and convertibles.

There’s no word on a launch window for devices with the new chip, but WinFuture says Asus is working on a Snapdragon 1000 device called “Primus.” This upcoming device is purportedly based on a Qualcomm reference design.

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This article and images were originally posted on [Android Authority] June 25, 2018 at 04:55AM. Credit to Author  and Android Authority | ESIST.T>G>S Recommended Articles Of The Day.

 

 

Qualcomm Snapdragon 710 and Snapdragon 730 specs leak in full

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According to GSMArena.com

Back in FebruaryQualcomm unveiled its Snapdragon 700 series with a focus on AI, as is the trend. According to the latest information, the first two chips in the lineup will be the Snapdragon 710 and Snapdragon 730 and their full specs just leaked online.

Sitting between the 600 series and the flagship 800 series, the 7xx will feature octa-core CPU where six of the cores are for efficiency and two of them for performance. Interestingly enough, the Snapdragon 730 will be built on the 8nm LPP process, making it the smallest one ever, manufactured by Samsung.

Qualcomm Snapdragon 710 and Snapdragon 730 specs leak in full

While the 10 nm LPE (Low-Power Early) process offers 27% higher performance and 40% lower consumption, compared with the 14 nm one, the LPP gives 10% performance improvement and 15% power reduction on top of these numbers.

The RF transmitter, listed as SDR660, is the same as the one in the Snapdragon 630 and Snapdragon 660, meaning upcoming phones will have the same band support as the phones powered by the latest 600-series chips.

The maximum supported resolution will be 3040 x 1440 or WQHD+, which is the 19:9 ratio that many phones with notches implement nowadays.

Qualcomm Snapdragon 710 and Snapdragon 730 specs leak in full

Since Qualcomm said the 700 series would be AI-oriented, there will be a specific machine learning neural processing unit called NPU 120, coupled with GPU/HVX on the Snapdragon 730, while the 710 will not have the dedicated NPU.

Phones with Snapdragon 710 are expected to arrive in the first half of 2019, and Xiaomi is rumored to be one of the first companies to release such a device. Since Samsung acquired qualification for the 8 nm LPP process in November, phones with Snapdragon 730 should be available at the end of the next year.

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This article and images were originally posted on [GSMArena.com] May 9, 2018 at 05:35AM. Credit to Author and GSMArena.com | ESIST.T>G>S Recommended Articles Of The Day

 

 

 

Watch out, Qualcomm: China set to launch $47 billion chip investment fund

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According to Android Authority

Cover Image: Chinese manufacturer Huawei’s Kirin 970 chip.

  • China is expected to announce a new $47 billion investment fund for its chip sector soon.
  • The fund will reportedly focus on microprocessors and graphics processing units, among other areas.
  • The news comes after ZTE was slapped with a U.S. supply ban, which could deprive the brand of Snapdragon chips.

China is reportedly set to announce a new 300 billion yuan ($47.4 billion) investment fund for its semiconductor industry. The fund will be used to develop the sector as Beijing tries to narrow the gap between U.S. chipset manufacturers and its own players, the Wall Street Journal (paywall) reported, citing sources familiar with the plans.

The fund’s focus will be on improving the local design and manufacturing of advanced microprocessors and graphics processing units. These components are key for smartphones, tablets, and PCs.

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The Chinese government reportedly approached U.S. chipmakers about investing in the new initiative. However, the foreign companies are unlikely to take part due to “politically sensitive timing” and the fact that the fund could reduce Chinese reliance on U.S. chips, a source said.

News of the fund comes a few weeks after Reuters unearthed Chinese plans to accelerate development of the local semiconductor sector. Senior government officials reportedly met with the local chip fund, industry organizations and regulators to discuss the scheme.

US chipmaker Qualcomm’s Snapdragon 845 chip.

The outlet suggested that companies like Huawei’s HiSilicon, Tsinghua Group, and Semiconductor Manufacturing International Corp could make huge strides as a result of the plans.

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China and the U.S. have been embroiled in a trade spat lately, as the U.S. slapped a supply ban on Chinese mobile brand ZTE. If confirmed, the Chinese company could lose its supply of valuable Snapdragon mobile chips by U.S. company Qualcomm. The ban came after ZTE violated sanctions against Iran.

Huawei is reportedly under investigation for violating Iran sanctions as well. The Chinese colossus was also set to announce deals with U.S. carriers back at CES 2018, but the U.S. government scuppered the plans.

News of the latest fund follows China’s 2014 chip fund, which raised a reported 139 billion yuan ($21.8 billion) and ignited tensions between Beijing and Washington. Former U.S. President Barack Obama’s advisors called China’s state investment in the sector a threat to the U.S. industry and sector at large.

Chinese officials are expected to announce the new initiative “soon.”

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This article and images were originally posted on [Android Authority] May 7, 2018 at 06:00AM. Credit to Author and Android Authority | ESIST.T>G>S Recommended Articles Of The Day

 

 

 

Intel reportedly looking to buy Broadcom, which is trying to take over Qualcomm

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According to Android Police – Android news, reviews, apps, games, phones, tablets

 

 

Despite being de facto leader of processors for desktops and laptops, Intel never made a large impression in the smartphone SoC market. The company spent around $10 billion attempting to compete with Qualcomm and other companies, but ultimately gave up in 2016. According to The Wall Street Journal, Intel is reportedly looking into purchasing Broadcom, assuming Broadcom’s hostile takeover of Qualcomm works out.

Back in November, Broadcom attempted to purchase Qualcomm, in what would be the single largest takeover of a chipmaker ever. The initial offer was declined by Qualcomm’s board of directors, as well as every subsequent counter offer. In response, Broadcom is attempting to replace some of Qualcomm’s board, allowing the purchase to be finalized. Qualcomm has also been trying to purchase NXP Semiconductors, to make matters more complicated.

Reportedly, Intel believes a combined Qualcomm and Broadcom would pose a serious threat to the company. While Intel no longer develops SoCs for smartphones, it still manufactures other components, like cell radios. Intel is eager for the hostile takeover to fail, but if Broadcom succeeds, it may try to purchase the combined company.

Intel is considering several other options as well, including making other smaller acquisitions in order to stay competitive. The consolidation of Qualcomm and Broadcom would already make the semiconductor industry significantly less competitive, and a possible buyout from Intel would only make the situation worse. No matter how this shakes out, consumers will be paying the price.

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This article and images were originally posted on [Android Police – Android news, reviews, apps, games, phones, tablets] March 9, 2018 at 09:22PM. Credit to Author and Android Police – Android news, reviews, apps, games, phones, tablets | ESIST.T>G>S Recommended Articles Of The Day

 

 

 

Massive demand will see 5G phones arrive in 2019 says Qualcomm

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According to Digital Trends

Why it matters to you

The benefits of a super-fast mobile network — from connected cars to streaming 4K video — may be felt a year earlier than previously predicted.

Qualcomm says we will start to enjoy the benefits of a 5G data connection on a smartphone in 2019, a year ahead of when others predict 5G will first become usable, and it’s all due to what the company calls increasing demands from eager tech fans and businesses. Qualcomm CEO Steven Mollenkopf said at the Frankfurt Motor Show that 5G will arrive in real devices during 2019, and added that should he have been asked last year, he would have estimated it would happen in 2020.

We should expect the United States, South Korea, and Japan to launch 5G phones and services in 2019, with China not far behind, according to Mollenkopf. He’s confident demand will be high, and carriers will want to be quick to launch competing services, so as not to be left behind.

The setting for Mollenkopf’s statement is important, and Qualcomm itself has plenty invested in not only making sure 5G arrives quickly, but also that it’s a roaring success when it does. At the Frankfurt Motor Show, Mollenkopf delivered a keynote presentation entitled New Mobility World, in which he described 5G as a key element for automotive innovation over the coming years, and talked about how “vehicle-to-everything” technology will see cars talk to everything from traffic signals to other vehicles, and even pedestrians. In early September Qualcomm announced a chipset dedicated to vehicle-to-everything communication. The 9150 C-V2X chip will be released toward the end of 2018.

5G’s success will also depend on networks, and Qualcomm is romancing them, too. It’s working with Verizon, and with Sprint and parent company Softbank, on 5G tests and technology. When it announced the partnership with Sprint in May 2017, it also included a late 2019 estimate for the first 5G commercial services. Also in September, Qualcomm and Nokia teamed up to test 5G NR radio technology, an essential part of its plans to have the next-generation cellular system up and running for 2019.

Qualcomm isn’t the only one working on 5G. The company’s prediction came just ahead of a Huawei and Deutsche Telekom announcement, where a live 5G NR test in Berlin — the first 3GPP 5G connection of its type in Europe — saw a connection speed of 2Gpbs. Huawei said its partnership with Deutsche Telekom should see 5G services launch in Europe by 2020.

 

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This article and images were originally posted on [Digital Trends] September 18, 2017 at 07:23AM

Credit to Author and Digital Trends

 

 

 

Seneo PA014B Fast Wireless Charger with Quick Charge 3.0 Wall Charger Qualcomm Certified

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Price: $49.99
Sale: $28.99
  • APPLICABLE MODES: Fast charging function is ONLY applicable for Galaxy models – S6 Edge+, S7, S7 Edge, Note 5 models. This Quick Charge wireless charger can charge your Galaxy devices from dead to full in just two and a half hour
  • HOLDER STAND DESIGN: Customers can charge their phone vertically or horizontally, which means they can enjoy movie and music, making calls or sending messages without interrupting while charging.
  • INTELLIGENT LED INDICATOR: Intelligent LED indicator shows the status of safety charging. The wireless charging stand will turn into blue for 2 seconds when it connect to the power, and will turn into green and stays when it start to charge the phone.
  • POWER ADAPTER INCLUDED: Comes with a Quick Charge 3.0 WALL CHARGER (Qualcomm Certified) for faster charging. Built in over-voltage, under-voltage and short circuit protection ensure a safety charging environment
  • TIPS: It’s normal for your phone to get warm or even warmer during the charging process, and the PHONE CASES is suggested to be REMOVED while charging.

Product description

High Charging Speed

This wireless charger can offer a higher charging speed as its output up to 2A. For some models featuring with fast charging function, such as S6 Edge+, S7, S7 Edge, Note 5 models, it is able to charge them from dead to full in 2.5 to 3 hours, which is 1.4 times faster than standard wireless charger.

Wireless Charging Convenience

It will bring you a great convenience to use this wireless charger at home or in the office since you don’t have to plug in or pull out the USB connector again and again when answering phone calls and there will be no messy cables on you table. No more finding a compatible cable everywhere. Just place your phone on the charger stand with a free position and charging starts at once with quick response.

Best Viewing Angle

This wireless charger is designed with a 60 degree angle which is the best visual angle for hands-free video chatting, reading e-books, watching movies, browsing webpages and etc. Free your hands from holding the phone when enjoying a movie. Also, you can easily read your incoming messages without picking up your phone.

Package Included

1 x Seneo Wireless Charger Stand

1 x QC 3.0 Wall Charger

1 x USB Cable

1 x User Manual

Specifications for QC 3.0 Wall Charger:

Product Dimensions:1.75 x 1.73 x 1.02 inch

Input:AC 100-240V -50/60Hz 0.5A

Output:DC 3.6-6.5V/3A. 6.5-9.0V/2A. 9.0-12.0V/1.5A.

Output power:18W

Note

PHONE CASE is strongly suggested to be REMOVED while charging (Especially those leather wallet equipped with a magnetic metal plate, that may cause an over-heat issue)

Warranty

Every Seneo product provides a 45-day money back guarantee and 18-month warranty.

Customer Reviews 4.3 out of 5 stars

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Qualcomm Announces 802.11ax Access Point and Client Solutions

Wi-Fi platforms have traditionally focused on peak speeds. However, evolving usage scenarios (such as stadium and campus environments and even households with multiple Wi-Fi devices) have led to the appearance of standards aimed at solving the ‘capacity’ problem. We saw 802.11ac Wave 2 devices come to the market over the last couple of years. MU-MIMO on the downlink side was one of the first features to address this capacity issue.

802.11ax is set to become the next major leap in Wi-Fi technology. The last major introduction (802.11ac) has since been complemented by 802.11ad in the 60 GHz band, but, 802.11ax is the technology that will provide performance benefits in the 2.4 GHz and 5 GHz bands. Quantenna was the first to announce a draft-802.11ax-compliant access point radio solution back in October 2016. It was a 12-stream solution with 8×8 in the 5 GHz band and 4×4 in the 2.4 GHz band. They followed it up with a CES 2017 announcement for their mid-range solution (8-stream with 4×4 in the 5 GHz and 4×4 in the 2.4 GHz bands) targeting the same market. Today, Qualcomm has become the second vendor to announce a 802.11ax solution. Unlike Quantenna’s focus on the access point side, Qualcomm is announcing products for both the AP and client device markets.

IPQ8074

Similar to the Quantenna QSR10G-AX, the IPQ8074 is also a 12-stream solution (8×8 5GHz + 4×4 2.4GHz). However, in addition to the baseband, it also integrates a network processor. On the baseband side, the IPQ8074 supports 80 MHz channel width and has MU-MIMO for both uplink and downlink. In addition to the baseband radios, the IPQ8074 also integrates a quad-core Cortex-A53 (running at up to 2 GHz) and a dual-core network accelerator for deep packet inspection and other such applications. interfaces similar to the existing IPQ solutions (for USB and PCIe lanes) are supported. On the network side, a network switch with support for up to four Gigabit MACs is also available. The IPQ8074 SoC also supports NBASE-T, with up to two 10G interfaces supported. The SoC is fabricated in a 14nm processor. Qualcomm expects that access points using the IPQ8074 SoC can be powered via PoE.

QCA6290

The QCA6290 client device platform is a 2×2 802.11ax solution with concurrent dual-band operation. IIt is fabricated in a 28nm process. The platform supports the 802.11ax power saving features along with some proprietary Qualcomm extensions for better battery life. Qualcomm expects the QCA6290 to be integrated into computing systems rather than being a part of a USB WLAN adapter. The QCA6920 interfaces with the host system via a PCIe 2.1 x1 link. Qualcomm didn’t provide us with concrete power consumption limits (such as the 15W PoE budget for systems based on the IPQ8074) for cards integrating the platform.

Qualcomm claims that their proven MU-MIMO leadership experience as well as their expertise with OFDMA / LTE (based on their cellular background) gives them a edge when it comes to 802.11ax solutions. Note that existing networks with 802.11ac MU-MIMO devices can also benefit in a 802.11ax network.

Traditionally, Qualcomm’s main competition in the Wi-Fi space has been Broadcom. However, since the acquisition by Avago, things have been relatively quiet and no 802.11ax solutions have been publicly announced by them. Marvell does have 802.11ax solutions in their roadmap, though they weren’t willing to discuss specifics when I talked to them at CES 2017. In any case, Marvell’s focus has been more on the enterprise space. The main competition (based on announcements from other vendors) is Quantenna’s radio-only solutions. Based on the quotes in Quantenna’s launch release, it appears that they are teaming up with Cavium Networks for the network processor component. This works well in the enterprise space and for specific service provider use-cases. However, most market segments prefer the complete platform (radios and network processor) from one vendor. The platform might be either discrete radios and NPUs or a SoC with integrated radios like the IPQ8074 being launched today. The integration of the radios and NPU into a single chip will definitely make it simpler for router / gateway vendors to bring a product into the market. Another aspect to consider is the unified memory space offered to both the baseband and the network processor in the case of the integrated SoC – as the PHY rates from the radio move beyond the gigabit barrier, this becomes important for the performance and energy efficiency of the system.

From an adoption perspective, it is good to see that both AP and client platforms being launched simultaneously. Qualcomm expects routers based on the IPQ8074 SoC to come to the market before the end of the year. Client devices using the QCA6290 are expected in 2018.

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Qualcomm announces Snapdragon 835 and Quick Charge 4, compatible with USB Power Delivery

The march of chipset progress goes on: Qualcomm announced this morning that its new Snapdragon 835 chipset is on the way, utilizing Samsung’s new 10 nanometer fabrication process, as well as the latest generation of its Quick Charge technology. Qualcomm did not share many details about its newest flagship processor, only claiming unspecified increases in speed, efficiency, and a reduction of physical space used by the chip (all at least partly a result of the switch from 14nm to 10nm). Qualcomm says Snapdragon 835 devices will be arriving on the market in the first half of 2017. Number of cores and other improvements were not disclosed – this appears to be a strictly preliminary announcement. The most we got was this, some figures expressing the theoretical advantages of the new 10nm process.

Compared to its 14nm FinFET predecessors, Samsung’s 10nm technology allows up to a 30% increase in area efficiency with 27% higher performance or up to 40% lower power consumption.

These figures should not be interpreted to represent increases in performance or efficiency of the Snapdragon 835 versus the outgoing Snapdragon 820 and 821 – they merely show what the reduced transistor size can achieve on paper. It’s still impressive: Qualcomm’s chip is the first to be launched on this new process, and shrinks like this always result in noticeable performance and power consumption improvements.

Quick Charge 4 received a more thorough introduction, and perhaps unsurprisingly the headline feature of the newest fast charging implementation from Qualcomm is compliance with the USB-IF’s specifications for USB-C and the USB Power Delivery standard. So, if Qualcomm is now using the standard voltage, amperage, communication protocol, and interface that everyone with USB Power Delivery is, what’s left for Quick Charge 4 to do? Well, if you ask me, that’s a slightly harder sell than Qualcomm wants consumers and the industry to think. What Qualcomm claims is that through its advanced power management software and circuitry, it can charge phones more quickly, efficiently, and safely than just any old USB-PD device.

Qualcomm says that despite being the same wattage as the outgoing 3.0 specification (18W), Quick Charge 4 can charge a device up to 20% faster thanks to improvements in how the power is delivered and intelligently adapts to the state and heat of the battery, and by reducing thermal inefficiencies in the charging process. That is: Qualcomm very much believes that not all USB-PD charging systems are created equal, and this is probably their pitch to manufacturer partners who would still need to use Qualcomm-certified power management ICs to take advantage of Quick Charge 4.

We’ve got some slides below for you to peruse, and there is a fair bit of information to tear through here. Qualcomm’s play with bringing Quick Charge into the USB-PD fold is also to take advantage of, ahem, “awareness” of the potentially explosive nature of lithium ion batteries, and play up Quick Charge’s enhanced focus on safety. It’s not clear how appreciably safer Quick Charge is than any other fast charging solution, though, and the one thing that does seem safe is to say Qualcomm is trying to maintain Quick Charge’s market dominance by appealing to the post-Note7 sensibilities of manufacturers and consumers alike.

As for information about the 835, given devices are coming in the first half of 2017, I expect we’ll be hearing more about it around that time.

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DARPA and Qualcomm brain implants for 6G and neural engineering 

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It would be the ultimate user interface: a device the size of two stacked nickels that allows your thoughts to control computers. The only catch is it’ll have to be implanted in your brain.

That’s what the Department of Defense’s cutting-edge research unit DARPA is working on, as part of President Obama’s BRAIN Initiative, a concerted push to advance neuroscience. It’s also what Qualcomm chief technology officer Matt Grob believes could come to market for consumers when 6G, or so-called sixth generation wireless technologies, arrives.

“When you look at 1G being for voice, for your ears. And 3G through 5G are data for your eyes, for a vision service. perhaps 6G will go beyond the head mounted displays to introduce direct neural interface,” Grob said at Quartz’s The Next Billion conference held in San Francisco on Oct. 13.

Qualcomm is a member of the industry group that’s been formed to support the DARPA project with access to its rapid prototyping and manufacturing of neuro-engineering components. Qualcomm, which makes smartphone chips and was a key developer of the LTE technology behind 4G, is well-positioned to contribute. It will give DARPA access to charging and powering solutions for brain implants, ultra-low-power electronics designs and data compression and processing technology, according to DARPA (pdf).

Implants could feed sensory data into the brain at high resolution, and it could be one way to address sight or hearing deficits, DARPA said when the Neural Engineering System Design program was announced. “Today’s best brain-computer interface systems are like two supercomputers trying to talk to each other using an old 300-baud modem,” said Phillip Alvelda, the NESD program manager, at the time.

Low-power brain implants hooked up to ultra-high speed 6G data networks would certainly make Google Glass and Snap’s Spectacles look antiquated. But don’t hold your breath: New generations of wireless tech have generally been introduced in 10-year phases, which puts 6G’s arrival at 2030.

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Original article posted on Quartz

 

 

 

Qualcomm’s 5G preview: High frequencies, 5-gigabit speed.

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5G networks will be five times as fast as the quickest LTE technology by using the highest cellular frequencies ever, according to Qualcomm, which provided a glimpse of its next-generation modem plans on Tuesday.

The X50 modem won’t ship until the first half of 2018, and 5G networks aren’t expected to go commercial until 2020. But Qualcomm will have a lot to say about the new technology at its 4G/5G Summit in Hong Kong. At the same event, it’s announcing plans around its gigabit-speed X16 LTE modem.

The X50 will offer download speeds as high as 5Gbps (bits per second), where networks support them, using millimeter-wave frequencies and futuristic techniques for beaming signals to devices, according to slides prepared for the 4G/5G Summit. Qualcomm shared the materials in advance.

The X50 initially will use the 28GHz band, which is also the focus of 5G development work at the Verizon 5G Technology Forum and Korea Telecom 5G Special Interest Group. It’s one of several millimeter-wave bands that are widely expected to be used for 5G.

Cellular networks up to now have stayed below 6GHz, because higher frequencies don’t naturally travel as far or go through objects as easily. But a lot more bandwidth is expected to become available in millimeter-wave bands in the coming years. Qualcomm says the X50 will be able to use a combined 800MHz of spectrum, compared with up to 80MHz for the X16.

The future modem will use several emerging techniques to make this work. Key tools are beam-forming and beam-tracking, in which a cell can focus its signal to reach a specific mobile device and then follow that device as it moves around. The X50 will even be able to bounce its signal off hard surfaces in order to get around objects between the cell and the user.

Qualcomm expects the X50 modem to ship to system makers in sample quantities starting in the second half of next year. Combined with a gigabit-speed LTE modem, the X50 will form the basis of dual-mode 4G/5G devices. LTE and 5G are expected to coexist for many years.

Meanwhile, the X16 LTE modem will be coming out in a consumer device in the next few months. The NetGear Mobile Router MR1100, a mobile hotspot that provides a Wi-Fi connection on the go, will be sold by Australian carrier Telstra, Qualcomm announced Tuesday.

The company is also announcing that the X16 will be integrated into its next-generation processor in the Snapdragon 800 class, Qualcomm’s line of chips for high-end mobile devices.

The X16 uses a variety of techniques to reach a theoretical maximum speed of 1Gbps – a rate that no user is likely to get in the real world but is well above comparable top speeds on current LTE devices.

Among other things, it can use many antennas to create four streams of bits and can combine multiple chunks of spectrum to create a fatter pipe.

One technique the X16 can use to create that fat pipe is controversial: It’s equipped for LTE-U (LTE-Unlicensed), which combines channels used by Wi-Fi with a carrier’s licensed spectrum. It could give cellular customers better LTE performance in crowded areas, but some Wi-Fi supporters are concerned it might degrade other people’s Wi-Fi experience.

A set of coexistence tests approved by both sides last month should prevent that from happening. But in much of the world, including Europe and Japan, LTE-U won’t even be allowed. There, carriers are looking to LAA (Licensed Assisted Access) to achieve the same thing. LAA has different protections for Wi-Fi built in. Interestingly, in its slides on the announcement at the 4G/5G Summit, Qualcomm said the X16 supports LAA but didn’t mention LTE-U. The company did confirm that the modem will support LTE-U.

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Original article posted on computerworld.com

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Qualcomm introduces new Clear Sight dual camera system | ESIST

We’ve seen dual-camera setups on phones before, and Qualcomm has been at the front of the pack with phones like the LG G5 and its excellent dual camera configuration. Today’s news promises to improve the next generation to make things even better. Clear Sight will use two camera lenses — one color and one black and white — along with new software to allow the Spectra image signal processor to grab both images simultaneously and merge them instantly. The camera sensors are identical, outside of one important difference — a color filter. By doing this, you’ll be able to take great pictures with even less available light than we can today.

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BY JERRY HILDENBRAND

Source: Qualcomm introduces new Clear Sight dual camera system | Android Central

To Make Drone Deliveries Work, AT&T Is Tapping Into the Cell Network | ESIST

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The feds finally made it reasonably easy to get a drone pilot’s certificate, but it’s clear they still see unmanned aviation as a dodgy proposition. Among the many questions that come with any new tech is a basic limitation: The radio links and Wi-Fi that control the aircraft limit range to a few thousand feet, and aren’t robust enough for reliable drone control over long distances.

So the new rules, which took effect last month, limit drone use to visual line-of-sight operation, hamstringing operators interested in delivery, search-and-rescue, and remote-inspection operations.

The solution may lurk in your own line-of-sight—on top of water towers and rooftops, or shrouded by poorly faked roadside “trees.” Qualcomm Technologies and AT&Tannounced today they’re collaborating to make wide-ranging drone operations reliable and safe, using current 4G LTE and future 5G networks.

The drones will connect to the towers via modems similar to those found in smartphones and automobiles equipped with their own cellular broadband capability, and they’ll be controllable from any distance, as long as the drone is within cell range. (Though that’s not always necessary, since then can fly autonomously though dead zones.)

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Source: To Make Drone Deliveries Work, AT&T Is Tapping Into the Cell Network | WIRED

Qualcomm unveils a wireless eye-tracking VR headset | ESIST

 

Another day, another VR headset that you will never be able to buy.

Today at the IFA conference in Berlin, Qualcomm unveiled a reference design for an all-in-one headset built on the company’s new Snapdragon VR820 architecture.

The company’s Snapdragon 820 is already one of the most popular smartphone SoC’s on the market, but Qualcomm believes that mobile VR’s full potential isn’t being reached on the 820 because the headsets aren’t single-minded enough.

This headset design, built in partnership with Shenzhen-based Goertek, isn’t something that consumers are going to be able to try out, Qualcomm unveiled this as a reference design to entice OEMs to build all-in-one HMDs on the new VR820.

The design for this standalone headset includes integrated eye tracking with two cameras, dual front-facing cameras for inside-out positional tracking and four microphones. The system powers 1440×1440 per eye resolution being blasted at a rate of up to 70 frames per second.

Notably, this reference design also marks one of the first headsets from a major company that features eye-tracking baked-in. The company said it is using an existing company’s solution for this headset though they declined to comment on specific partners.

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Source: Qualcomm unveils a wireless eye-tracking VR headset | TechCrunch